CN/EN

產品與市場

Synamic 6

特點

● 高Tg 205℃ (DMA)
● 低Dk/Df
● 更優良的耐熱性,Td>400℃, T300>60min
● 更低的Z軸熱膨脹系數,優異的通孔可靠性
● 更低的吸水率,優異的耐濕耐熱性
● 兼容無鉛制程

應用領域

● 服務器、交換機、存儲、路由器、基站BBU等

● 高頻測量儀器等

● 光通信產品

  • 產品性能
  • 產品證書
  • 資料下載
Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 205
2.4.25D DSC
185
Td 2.4.24.6 5% wt. loss 402
T288
2.4.24.1 TMA min 120
T300 2.4.24.1
TMA min
60
Thermal Stress
2.4.13.1
288℃, solder dip
- PASS
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 50
After Tg ppm/℃ 210
50-260℃ % 2.0
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.70
2.5.5.5 (10GHz)
C-24/23/50
- 3.68
SPDR (10GHz)
C-24/23/50
- 3.99
Dissipation Factor
2.5.5.9 (1GHz)
C-24/23/50
- 0.0021
2.5.5.5 (10GHz)
C-24/23/50
- 0.0036
SPDR (10GHz)
C-24/23/50
- 0.0046
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.85 [4.86]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.09
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

1. All the typical value is based on 0.76mm (6*2116) thickness specimen.

2. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.

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