CN/EN

產品與市場

Synamic 6GX

特點

● 低Dk/Df@10GHz: 3.73/0.005
● 更優異的耐熱性,Td>400℃,T300>60min
● 更低的Z軸熱膨脹系數,優異的通孔可靠性
● 更低的吸水率,優異的耐濕耐熱性
● 無鉛制程兼容

應用領域

● 超高速網絡設備

● 服務器、交換機、存儲、路由器、基站BBU等

● 高性能計算機

● 光通信產品

  • 產品性能
  • 產品證書
  • 資料下載

Items Method Condition Unit Typical Value
Tg 2.4.24.4 DMA 170
Td 2.4.24.6 5% wt. loss 405
T288
2.4.24.1 TMA min >60
T300 2.4.24.1
TMA min
>60
Thermal Stress
2.4.13.1
288℃, solder dip
s 100
CTE (Z-axis) 2.4.24 Before Tg ppm/℃ 31
After Tg ppm/℃ 205
50-260℃ % 2.2
Dissipation Constant
2.5.5.9 (1GHz)
C-24/23/50
- 3.87
2.5.5.5 (10GHz)
C-24/23/50
- 3.73
Dissipation Factor 
2.5.5.9 (1GHz)
C-24/23/50
- 0.0023
2.5.5.5 (10GHz)
C-24/23/50
- 0.0050
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm [lb/in] 0.9 [5.14]
Water Absorption 2.6.2.1 E-1/105+D-24/23 % 0.08
Flammability
UL94
C-48/23/50
Rating
V-0

Explanations: C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning.

The figures following the letter symbols indicate with the first digit the duration of the preconditioning in hours, with the second digit the preconditioning temperature in ℃ and with the third digit the relative humidity.



Remarks:

Remarks:

1. All the typical value is based on 6*2116 (0.76mm) thickness specimen, not guarantee data.

2.All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

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