CN/EN

產品與市場

S6015

特點

● 不含鹵素,無玻纖增強材料,適用于常規HDI制作工藝
不掉樹脂粉,污染少
可與常規FR-4.0半固化片媲美的保存期
較低的介電常數,有利于特性阻抗控制及提高信號傳輸速度

應用領域

適用于制作無鹵化趨勢的手持式電子產品,如手機、PDA、數碼攝像機等
  • 產品性能
  • 產品證書
  • 資料下載
Items Method Condition Unit Typical Value
Tg 2.4.25D DSC
145
Thermal Stress
2.4.13.1
288℃/20s
- pass
Dissipation Constant (1GHz) 2.5.5.9 C-24/23/50 - 3.4
Dissipation Factor (1GHz)
2.5.5.9
C-24/23/50
- 0.018
Volume Resistivity 2.5.17.1 C-96/35/90 MΩ.cm 5 x 108
Surface Resistivity
2.5.17.1
C-96/35/90 5 x 109
Peel Strength (1Oz) 2.4.8 288℃/10s N/mm 1.2
Flammability
UL94
C-48/23/50
Rating
V-0

Remarks:

All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water,E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in and the third digit the relative humidity.


青青草视频在线观看网站